World’s Leading Chipmakers have integrated to develop a new Universal Chiplet Interconnect Express (UCIe) standard for better interoperability of chiplets. Intel, Qualcomm, TSMC, Arm, Meta, AMD, Google, and Microsoft have collaboratively backed the initiative.
The collaborating group supports the Universal Chiplet Interconnect Express (UCIe), which will create a die-to-die interconnect system and will also “promote an open chiplet environment.”
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated.
An emerging concept of the Semiconductor Industry is using Chiplet, where several small dies are incorporated to make the processor instead of a single monolithic die. The concept of chiplets can help replace the destroyed or defective core of the chip rather than throwing out the whole chip.
However, the interoperability of chiplets from different manufacturers was not available. But now the collaborating firms in the newly introduced standard UCIe intend to resolve this issue.
Intel’s VP Sandra Rivera said, “Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel’s IDM 2.0 strategy.”